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Thermoelectric measurements for bondability analysis of bond pads: a new concept for a bondability analyser
Author(s) -
Gröning P.,
Schwaller P.,
Schneuwly A.,
Schlapbach L.
Publication year - 1999
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/(sici)1096-9918(199908)28:1<191::aid-sia605>3.0.co;2-#
Subject(s) - analyser , materials science , wire bonding , ultrasonic sensor , thermoelectric effect , ball (mathematics) , thermocouple , bond , process (computing) , composite material , mechanical engineering , acoustics , computer science , engineering , optics , electrical engineering , thermodynamics , physics , geometry , chip , mathematics , finance , economics , operating system
We present a new apparatus to determine the ultrasonic wire bonding behaviour of different contact materials. The basic principle of the developed bondability analyser is measurement of the temperature at the bond ball during the ultrasonic friction process by using a thermocouple instead of a bond wire. We tested the bondability analyser by analysing different bond pads with high and low bond contact quality and comparing the results with pull force measurements of the wire bond. The results show that the bondability analyser characterizes the ultrasonic wire bonding behaviour of bond pads perfectly. In addition, the apparatus allows the wire bonding process to be studied in detail and in real time. Copyright © 1999 John Wiley & Sons, Ltd.