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Combined ToF‐SIMS/XPS study of plasma modification and metallization of polyimide
Author(s) -
Wolany D.,
Fladung T.,
Duda L.,
Lee J. W.,
Gantenfort T.,
Wiedmann L.,
Benninghoven A.
Publication year - 1999
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/(sici)1096-9918(199907)27:7<609::aid-sia523>3.0.co;2-#
Subject(s) - polyimide , x ray photoelectron spectroscopy , materials science , plasma , analytical chemistry (journal) , composite material , chemical engineering , chemistry , layer (electronics) , environmental chemistry , physics , engineering , quantum mechanics
The combination of time‐of‐flight secondary massspectrometry (ToF‐SIMS) and monochromatizedx‐ray photoelectron spectroscopy (XPS) has proved tobe a valuable tool for the analysis of chemically modified polymersurfaces. By applying these techniques in situ , together witha plasma modification chamber and a Knudsen cell, we haveinvestigated the plasma modification of polyimide in an oxygen plasmaand the first steps of copper deposition on the untreated and theplasma‐modified polyimide substrate. Characterization of theinitial stages of copper deposition by XPS and comparison with theuntreated and the plasma‐modified substrate indicate that, inthe case of the untreated substrate, copper binds to the carbonylgroup of the repeat unit, whereas after plasma modification a greatnumber of C–O and C–N functionalities are available asbinding sites for the metal overlayer. The molecular ion speciesidentified by ToF‐SIMS allow the identification of specificplasma‐induced fragmentation mechanisms and confirm theinterface reaction mechanisms deduced from the XPS results. Thenature and amount of copper–substrate bonds are directlycorrelated to the adhesion strength of the copper/polyimideinterface as measured by the force applied in a standard industrialpeel test. Copyright © 1999 John Wiley & Sons, Ltd.