Premium
Quantitative material characterization by ultrasonic AFM
Author(s) -
Yamanaka K.,
Noguchi A.,
Tsuji T.,
Koike T.,
Goto T.
Publication year - 1999
Publication title -
surface and interface analysis
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.52
H-Index - 90
eISSN - 1096-9918
pISSN - 0142-2421
DOI - 10.1002/(sici)1096-9918(199905/06)27:5/6<600::aid-sia508>3.0.co;2-w
Subject(s) - cantilever , stiffness , wafer , deflection (physics) , vibration , elasticity (physics) , materials science , excitation , atomic force acoustic microscopy , non contact atomic force microscopy , ultrasonic sensor , silicon , optics , chemistry , atomic force microscopy , composite material , acoustics , conductive atomic force microscopy , magnetic force microscope , optoelectronics , nanotechnology , physics , magnetization , quantum mechanics , magnetic field
In an atomic force microscope equipped with a micromachinedcantilever tip, the cantilever vibration spectra in contact with thesample were found to be strongly dependent on the excitation power.However, if the excitation power is small enough, the resonance peakwidth decreases and the peak frequency increases to a certainlimiting value. In this condition the tip–sample contact iskept linear, and satisfactory agreement between the measured andcalculated frequency is obtained, assuming a constant contactstiffness; the agreement is further improved by taking into accountthe lateral stiffness. More quantitative information on theelasticity of the sample is obtained from the contact load dependenceof the frequency, where contact stiffness of a non‐sphericaltip shape is derived from the Sneddon–Maugis formulation, andthe tip shape index is estimated by an inverse analysis of theload–frequency relation. A further advantage of evaluating notonly the vertical but also the lateral stiffness is demonstrated on aground silicon wafer by simultaneous measurement of deflection andtorsional vibration. Copyright © 1999 John Wiley & Sons,Ltd.