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Front Cover: Halogen Bonding as a Tool to Control Morphology and Charge (Angew. Chem. Int. Ed. 21/2025)
Author(s) -
Ruoko TeroPetri,
Stoeckel MarcAntoine,
Puttreddy Rakesh,
Yang ChiYuan,
Zhang Silan,
Wu Ziang,
Candeias Nuno R.,
Samorì Paolo,
Woo Han Young,
Fabiano Simone,
Priimagi Arri
Publication year - 2025
Publication title -
angewandte chemie international edition
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 5.831
H-Index - 550
eISSN - 1521-3773
pISSN - 1433-7851
DOI - 10.1002/anie.202508978
The cover image illustrates the use of halogen bonding to control the morphology and charge transport of organic semiconductors used for organic field effect transistors (OFETs). The semiconductors were functionalized with halogen bond accepting groups that bind non‐covalently with external halogen bond donor additives, improving the crystallinity, molecular packing, and OFET performance of the organic semiconductor. Details of this study are reported by Tero‐Petri Ruoko, Simone Fabiano, Arri Priimagi, and co‐workers in their Research Article ( e202424979 ).
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