Open AccessThermal Drift and Chip Size in Capacitive Pressure Sensors
Author(s) -
G. Blasquez,
X. Chauffleur,
P. Pons,
C. Douziech,
P Favaro,
Philippe Ménini
Publication year - 1999
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - capacitive sensing , materials science , thermal , chip , internal pressure , finite element method , silicon , anodic bonding , pressure sensor , metrology , thermal analysis , microelectromechanical systems , etching (microfabrication) , optoelectronics , wafer bonding , mechanical engineering , composite material , optics , electrical engineering , structural engineering , engineering , thermodynamics , physics , layer (electronics)
Accelerating Research
Robert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom
Address
John Eccles HouseRobert Robinson Avenue,
Oxford Science Park, Oxford
OX4 4GP, United Kingdom