Open Access3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules
Author(s) -
Bassem Mouawad,
Cyril Buttay,
Maher Soueidan,
Hervé Morel,
Bruno Allard,
Damien Fabrègue,
Vincent Bley
Publication year - 2012
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - Uncategorized
Resource type - Conference proceedings
Subject(s) - interconnection , materials science , die (integrated circuit) , spark plasma sintering , dbc , electroplating , soldering , wire bonding , direct bonding , copper , power module , integrated circuit packaging , semiconductor , electrical engineering , optoelectronics , power (physics) , metallurgy , computer science , sintering , composite material , integrated circuit , cmos , engineering , chip , nanotechnology , silicon , physics , quantum mechanics , computer network , layer (electronics)
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