Open Access3-Dimensional, Solder-Free Interconnect Technology for high-Performance Power Modules
Author(s) -
Bassem Mouawad,
Cyril Buttay,
Maher Soueidan,
Hervé Morel,
Bruno Allard,
Damien Fabrègue,
Vincent Bley
Publication year - 2012
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - Uncategorized
Resource type - Conference proceedings
Subject(s) - interconnection , soldering , integrated circuit packaging , electronic engineering , power (physics) , electrical engineering , materials science , computer science , automotive engineering , engineering , chip , telecommunications , physics , composite material , quantum mechanics