Open AccessThrough-silicon via based 3D IC technology: Electrostatic simulations for design methodology
Author(s) -
M. Rousseau,
O. Rozeau,
G. Cibrario,
G. Le Carval,
Marie-Anne Jaud,
P. Leduc,
A. Farcy,
A. Marty
Publication year - 2008
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - Uncategorized
Resource type - Conference proceedings
Subject(s) - spice , inverter , computer science , electronic engineering , finite element method , solid modeling , integrated circuit design , component (thermodynamics) , transistor , logic gate , engineering , electrical engineering , voltage , artificial intelligence , physics , structural engineering , thermodynamics