Open AccessEMC performance analysis of a Processor/Memory System using PCB and Package-On-Package
Author(s) -
Etienne Sicard,
Boyer, Alexandre,
Fernandez-Lopez, Priscillia,
Zhou, An,
Marier, Nicolas,
Lafon, Frédéric
Publication year - 2015
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - computer science , embedded system , package design , chip scale package , operating system , computer architecture , engineering , engineering drawing , telecommunications , chip