Open AccessMechanical stress induced by electromagnetic forces on wire bonds of high power modules
Author(s) -
Paul-Étienne Vidal,
Hassen Medjahed,
Jean-Marc Diénot,
Bertrand Nogarède
Publication year - 2012
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - stress (linguistics) , insulated gate bipolar transistor , wire bonding , power (physics) , materials science , characterization (materials science) , bond , electrical engineering , structural engineering , mechanical engineering , engineering , physics , voltage , nanotechnology , philosophy , linguistics , chip , quantum mechanics , finance , economics