Open AccessLow Cost 3D Multilevel Interconnect Integration for RF and Microwave Applications
Author(s) -
Ayad Ghannam,
Lamine Ourak,
David Bourrier,
Christophe Viallon,
Thierry Parra
Publication year - 2012
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - interconnection , microwave , radio frequency , computer science , electronic engineering , electrical engineering , computer architecture , engineering , telecommunications
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