Open AccessNon-destructive failure analysis and modelling of encapsulated miniature SMD ceramic chip capacitors using thermal and mechanical loading
Author(s) -
B. Wunderle,
Tanja Braun,
Daniel May,
Aref Mazloum,
M. Bouazza,
H. Walter,
Olaf Wittler,
R. Schacht,
K.-F. Becker,
Martin Schuster,
B. Michel,
H. Reichl
Publication year - 2007
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - materials science , capacitor , ceramic , chip , ceramic capacitor , composite material , thermal analysis , thermal , mechanical engineering , engineering , electrical engineering , voltage , physics , meteorology