Open AccessThrough Silicon Vias as Enablers for 3D Systems
Author(s) -
Erik Jung,
A. Ostmann,
Peter Ramm,
Jürgen Wolf,
Michael Toepper,
Maik Wiemer
Publication year - 2008
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - silicon , computer science , materials science , optoelectronics
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