Open AccessThrough Silicon Vias as Enablers for 3D Systems
Author(s) -
E. Jung,
A. Ostmann,
Peter Ramm,
J.K. Wolf,
Michael Toepper,
Maik Wiemer
Publication year - 2008
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - silicon , computer science , materials science , optoelectronics