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Impact of substrate coupling induced by 3D-IC architecture on advanced CMOS technology
Author(s) -
Maxime Rousseau,
Marie-Anne Jaud,
Patrick Leduc,
A. Farcy,
A. Marty
Publication year - 2009
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - nmos logic , cmos , transistor , materials science , leakage (economics) , electronic engineering , through silicon via , substrate coupling , optoelectronics , saturation (graph theory) , silicon , electrical engineering , engineering , layer (electronics) , nanotechnology , voltage , trench , mathematics , combinatorics , economics , macroeconomics

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