Open AccessLumped electro-thermal model of on-chip interconnects
Author(s) -
N. Spennagallo,
Lorenzo Codecasa,
D. D'Amore,
P. Maffezzoni
Publication year - 2006
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - Uncategorized
Resource type - Conference proceedings
Subject(s) - interconnection , chip , electronic engineering , thermal , computer science , system on a chip , integrated circuit design , integrated circuit packaging , materials science , electrical engineering , embedded system , engineering , physics , meteorology , computer network