Open AccessNumerical simulation of the polymer forming by hot embossing process
Author(s) -
Gang Cheng,
Jean-Claude Gélin,
Thierry Barrière
Publication year - 2011
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - embossing , finite element method , materials science , thermoplastic , process (computing) , forming processes , thermoplastic polymer , computer simulation , die (integrated circuit) , polymer , composite material , mechanical engineering , engineering drawing , computer science , structural engineering , engineering , simulation , nanotechnology , operating system
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