
Thermal study and adhesion of FFF process
Author(s) -
Arthur Lepoivre,
Nicolas Boyard,
Arthur Lévy,
Vincent Sobotka
Publication year - 2020
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - process (computing) , adhesion , materials science , computer science , composite material , programming language