Open AccessWeak bond strength between successive layers in extrusion-based additive manufacturing
Author(s) -
Emmanuel Keita,
Hela Bessaies-Bey,
Wenqiang Zuo,
Patrick Belin,
Nicolas Roussel
Publication year - 2019
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - extrusion , bond strength , bond , materials science , composite material , layer (electronics) , business , adhesive , finance
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