Mise en place d'un packaging 3D collectif de composants de puissance à structure verticale | Zendy

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Mise en place d'un packaging 3D collectif de composants de puissance à structure verticale

Author(s) -

Bastien Letowski,

J. Widiez,

Nicolas Rouger,

Marc Rabarot,

W. Vandendaele,

B. Imbert,

Jean-Christophe Crébier

Publication year - 2016

Publication title -

hal (le centre pour la communication scientifique directe)

Language(s) - French

Resource type - Conference proceedings

Subject(s) - humanities , art

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