Open AccessCOMPARISON OF THICK COPPER PLATING RESULTS WITH LABORATORY AND INDUSTRIAL ELECTROPLATING TOOLS
Author(s) -
David Bourrier,
Arnaud Durlach
Publication year - 2017
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - electroplating , copper , copper plating , plating (geology) , metallurgy , materials science , gold plating (software engineering) , engineering , composite material , geology , software engineering , layer (electronics) , geophysics
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