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Determination of the failure load of adhesive bonding by using a coupled criterion
Author(s) -
Jérémy Le Pavic,
Georgios Stamoulis,
Thomas Bonnemains,
D. D. da Silva,
David Thévenet
Publication year - 2017
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
Subject(s) - reliability (semiconductor) , adhesive , reliability engineering , stress (linguistics) , materials science , computer science , key (lock) , structural engineering , composite material , engineering , layer (electronics) , power (physics) , linguistics , physics , philosophy , computer security , quantum mechanics

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