Optimization for Die Attach Film Delamination on Nickel-Palladium-Gold Die Pad

In the Semiconductor Industry, the delamination performance of integrated circuit packaging is being aggressively improved. However, this task is complicated and difficult, as the defective failure is highly dependent on the compatibility of the material characteristics that may affect the entire Integrated Circuit package system under certain stress levels, both mechanical and thermal. This research work aims to study Die Attach process optimization in DAF adhesive for NickelPalladium-Gold Die Pad leadframe to achieve maximum reliability performance under IPC / JEDEC Moisture Sensitivity Level 1 (MSL1) at 260°C reflow. Strategic optimization of the Die Attach process is needed to ensure robust reliability. And one of the solutions is to apply the Scrubbing method, which is a machine feature used at a constant temperature to aid in the wetting of adhesives and the removal of voids.