English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Tools annual

Global: Zendy Free Plan

Global: Zendy Tools monthly

Global: Zendy Plus monthly

This technical paper discusses a methodological and systematic way of resolving key challenges during introduction of Chip-On-Lead package specifically wirebonding issues that leads to production dilemma during production ramp-up of products using copper wire in tapeless leadframe. The project was intended to determine the “Red-X” or the major cause of yield detractors that may lead to quality issue during wirebonding process. Problem solving tools were showcased in this paper such as Data Analysis, Cause and Effect, Design-of–Experiment (DOE) and mechanical dimensional analysis which provided substantial impact in determining the real root-cause of the problem. Step-by-step elimination of variables was achieved with the use of statistical engineering tools. Outcome of the project eliminated the occurrence of Non-Stick-On-Pad (NSOP) during wirebonding process without cost involved and just optimizing the available in-house resources. The improvements also enhanced the quality of the product after final test which on the other hand lower the risk of having potential customer complaint in the future. Original Research Article Sumagpang Jr. and Gomez; JERR, 3(2): 1-13, 2018; Article no.JERR.46080 2

Challenges and Resolution for Copper Wirebonding on Tapeless Leadframe Chip-on-Lead Technology