Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy | Zendy

JeeHwan Bae | Zendy; Keesam Shin | Zendy; Joonhwan Lee | Zendy; MiYang Kim | Zendy; CheolWoong Yang | Zendy

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Development of High-Temperature Solders: Contribution of Transmission Electron Microscopy

Author(s) -

JeeHwan Bae,

Keesam Shin,

Joonhwan Lee,

MiYang Kim,

CheolWoong Yang

Publication year - 2015

Publication title -

han-guk hyeonmigyeong hakoeji/applied microscopy

Language(s) - English

Resource type - Journals

eISSN - 2287-4445

pISSN - 2234-6198

DOI - 10.9729/am.2015.45.2.89

Subject(s) - soldering , materials science , reliability (semiconductor) , transmission electron microscopy , alloy , joint (building) , characterization (materials science) , layer (electronics) , metallurgy , nanotechnology , thermodynamics , engineering , physics , structural engineering , power (physics)

This article briefly reviews the results of recently reported research on high-temperature Pb-free solder alloys and the research trend for characterization of the interfacial reaction layer. To improve the product reliability of high-temperature Pb-free solder alloys, thorough research is necessary not only to enhance the alloy properties but also to characterize and understand the interfacial reaction occurring during and after the bonding process. Transmission electron microscopy analysis is expected to play an important role in the development of high-temperature solders by providing accurate and reliable data with a high spatial resolution and facilitating understanding of the interfacial reaction at the solder joint.

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