Open Access(Invited) Wafer Bow and Warpage
Author(s) -
Shinichiro Takasu,
Hideo Otsuka,
N. Yoshihiro,
T. Oku
Publication year - 1981
Publication title -
japanese journal of applied physics
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.487
H-Index - 129
eISSN - 1347-4065
pISSN - 0021-4922
DOI - 10.7567/jjaps.20s1.25
Subject(s) - wafer , materials science , slicing , bending , composite material , residual stress , dislocation , buckling , mechanical engineering , optoelectronics , engineering
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