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Thermal Conductivity and Mechanical Properties of Magnesium Oxide Reinforced Polyamide-66 Composites
Author(s) -
Seok-Ho Hwang
Publication year - 2015
Publication title -
elastomers and composites
Language(s) - English
Resource type - Journals
eISSN - 2288-7725
pISSN - 2092-9676
DOI - 10.7473/ec.2015.50.3.205
Subject(s) - materials science , composite material , flexural strength , izod impact strength test , ultimate tensile strength , compounding , polyamide , filler (materials) , composite number , thermal conductivity , flexural modulus , magnesium , metallurgy
Magnesium oxide (MgO) reinforced polyamide-66 (PA66) composites were prepared through melt-compounding method in order to determine the possibility of using MgO particle as conductive filler in the polymer-based composite. The effects of MgO filler content on the thermal conductivity and mechanical properties for the PA66/MgO composites were investigated. The results showed that the addition of MgO filler to the PA66 matrix led to a large increase in thermal conductivity of the PA66/MgO composites. Tensile strengths of the PA66/MgO composites were slightly decreased as MgO filler loading increased. However, flexural strength and flexural modulus were improved with increasing filler loading. Notched Izod impact strengths were dramatically lowered by the addition of MgO filler.

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