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A Survey Addressing On-Chip Interconnect: Energy and Reliability Considerations
Author(s) -
Jacob Postman,
Patrick Yin Chiang
Publication year - 2012
Publication title -
isrn electronics
Language(s) - English
Resource type - Journals
ISSN - 2090-8679
DOI - 10.5402/2012/916259
Subject(s) - reliability (semiconductor) , interconnection , computer science , chip , reliability engineering , embedded system , process (computing) , electronic engineering , cmos , efficient energy use , energy (signal processing) , computer architecture , engineering , telecommunications , electrical engineering , power (physics) , physics , quantum mechanics , operating system , statistics , mathematics
Scaling CMOS process technology continues to enable increased levels of system integration, leading to on-chip communication demands beyond what traditional digital signaling techniques can efficiently provide with sufficient reliability. In this paper we survey the state of the art of on-chip interconnect techniques for improving performance, energy, and reliability and provide a review of interconnect reliability considerations. Finally, we provide a case study to evaluate the efficiency of error correcting codes on a state-of-the-art energy-efficient low-swing interconnect.

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