Open AccessModeling Haptic Data Transfer Processes through a Thermal Interface using an Equivalent Electric Circuit Approach
Author(s) -
Yosef Y. Shani,
Simon Lineykin
Publication year - 2021
Publication title -
proceedings of the 15th international joint conference on biomedical engineering systems and technologies
Language(s) - English
Resource type - Conference proceedings
DOI - 10.5220/0010262101270135
Subject(s) - haptic technology , computer science , interface (matter) , equivalent circuit , thermal transfer , thermal , transfer (computing) , electrical engineering , voltage , electronic engineering , simulation , engineering , physics , bubble , maximum bubble pressure method , parallel computing , meteorology , inkwell , speech recognition
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