Open AccessEstimating Thermal Behavior and Analyzing Evolved Species of Adhesives Through Thermogravimetric Analysis combined with Spectrometric Techniques
Author(s) -
Han Chien Lin,
Takeshi Ohuchi,
Yasuhide Murase
Publication year - 2004
Publication title -
journal of the faculty of agriculture kyushu university
Language(s) - English
Resource type - Journals
eISSN - 2433-488X
pISSN - 0023-6152
DOI - 10.5109/4606
Subject(s) - thermogravimetric analysis , adhesive , thermal analysis , chemistry , thermal , organic chemistry , thermodynamics , physics , layer (electronics)
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