Open AccessThe Next Step to Higher Density Multilayer PWBs Using Microvia Technoligies. Plastic Package for Flip Chip Application Using Multi-Layered Build up Printed Wiring Board.
Author(s) -
Motoo Asai
Publication year - 1998
Publication title -
kairo jissō gakkaishi/kairo jissou gakkaishi
Language(s) - English
Resource type - Journals
eISSN - 1884-1201
pISSN - 1341-0571
DOI - 10.5104/jiep1995.13.70
Subject(s) - flip chip , printed circuit board , materials science , electronic engineering , system in package , chip , electrical engineering , composite material , engineering , layer (electronics) , adhesive