HOT WATER COOLED HEAT SINKS FOR EFFICIENT DATA CENTER COOLING: TOWARDS ELECTRONIC COOLING WITH HIGH EXERGETIC UTILITY
Author(s) -
Peter Kasten,
Severin Zimmermann,
Manish K. Tiwari,
Bruno Michel,
Dimos Poulikakos
Publication year - 2010
Publication title -
frontiers in heat and mass transfer
Language(s) - English
Resource type - Journals
SCImago Journal Rank - 0.404
H-Index - 18
ISSN - 2151-8629
DOI - 10.5098/hmt.v1.2.3006
Subject(s) - thermal fluids , frontier , data center , center (category theory) , heat sink , research center , water cooling , environmental science , heat transfer , thermal , nuclear engineering , mechanical engineering , thermodynamics , engineering , political science , thermal resistance , physics , chemistry , law , crystallography
Electronic data center cooling using hot water is proposed for high system exergetic utility. The proof-of-principle is provided by numerically modeling a manifold micro-channel heat sink for cooling microprocessors of a data center. An easily achievable 0.5l/min per chip water flow, with 60°C inlet water temperature, is found sufficient to address the typical data center thermal loads. A maximum temperature difference of ~8°C was found between the solid and liquid, confirming small exergetic destruction due to heat transport across a temperature differential. The high water outlet temperature from the heat sink opens the possibility of waste heat recovery applications.
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