PERFORMANCE EVALUATION OF THERMOSYPHON INTEGRATED HEAT SINK FOR CPU COOLING | Zendy

Shanmuga Sundaram Anandan | Zendy; Anirudh Bhaskaran | Zendy

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PERFORMANCE EVALUATION OF THERMOSYPHON INTEGRATED HEAT SINK FOR CPU COOLING

Author(s) -

Shanmuga Sundaram Anandan,

Anirudh Bhaskaran

Publication year - 2012

Publication title -

frontiers in heat pipes

Language(s) - English

Resource type - Journals

ISSN - 2155-658X

DOI - 10.5098/fhp.v3.1.3003

Subject(s) - thermosiphon , heat sink , frontier , computer cooling , computer science , environmental science , architectural engineering , nuclear engineering , mechanical engineering , engineering , political science , heat exchanger , thermal management of electronic devices and systems , law

An experimental study on Thermosyphon Integrated Heat Sink (TIHS) for CPU cooling has been carried out for both natural and forced convection to analyze the performance characteristics of the CPU cooling module (TIHS) at steady state condition. A thermal model based on the experimental values has been developed to study the thermal behavior of Thermosyphon Integrated Heat Sink during CPU cooling. The thermal model is employed to determine the actual heat transfer and the effectiveness of the CPU cooling module and compared it with the conventional cooling method and found that there is an appreciable improvement in the proposed CPU cooling module.

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