English (United Kingdom)

https://curated-unify.zendy.io/wp-json/zendy-region/v1/featured_content/oa?rat=en

https://curated-unify.zendy.io/wp-json/zendy-region/v1/highlighted_journal/

Global: Zendy Plus annual

Presents the access of premium content as premium feature

Premium Content

Presents the keyphrase highlighting as premium feature

Keyphrase Highlighting

Presents the summarisation as premium feature

Summarisation

Insights

Presents the pdf analysis as premium feature

PDF Analysis

Presents the zaia usage as premium feature

ZAIA

Global: Zendy Plus monthly

Global: Zendy Tools annual

Global: Zendy Tools monthly

Global: Zendy Free Plan

Temperature and liquid-vapor interface measurements obtained with a flat plate heat pipe (FPHP) in various experimental conditions are presented. The grooved FPHP is made of copper. The results are compared to a thermal model, developed in a previous work, in which heat conduction in the FPHP wall as well as evaporation and condensation heat transfer phenomena are taken into account. The model depends on the shape of the liquidvapor interface in the grooves and on the fins at the condenser. A good agreement is found between the evaporation model and the experimental data. However the results of the condensation model overestimate the heat transfer coefficient, due to a bad estimation of the condensate film on the fins. Experimental measurements obtained with a second FPHP made of silicon are used to analyze the shape of this film. For both evaporation and condensation models, the results show a strong influence of the accommodation coefficient.

INVESTIGATION OF EVAPORATION AND CONDENSATION PROCESSES SPECIFIC TO GROOVED FLAT HEAT PIPES