Preparation and Curing Studies of Maleimide Bisphenol-A Based Epoxy Resins | Zendy

Shivananda Kammasandra Nanjunda Gowda | Zendy; K. N. Mahendra | Zendy

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Preparation and Curing Studies of Maleimide Bisphenol-A Based Epoxy Resins

Author(s) -

Shivananda Kammasandra Nanjunda Gowda,

K. N. Mahendra

Publication year - 2006

Publication title -

bulletin of the korean chemical society

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.237

H-Index - 59

eISSN - 1229-5949

pISSN - 0253-2964

DOI - 10.5012/bkcs.2006.27.10.1542

Subject(s) - maleimide , isophorone , epoxy , diamine , polymer chemistry , bisphenol a , curing (chemistry) , imide , chemistry , bisphenol , solvent , diglycidyl ether , organic chemistry

Maleimide modified epoxy compounds were prepared by reacting N-(4-hydroxyphenyl) maleimide (HPM) with diglycidylether of bisphenol-A. Triphenylphosphine was used as catalyst and methylethylketone as solvent. The resulting compound possessed both the oxirane ring and maleimide group. The curing reaction of the maleimide epoxy compound with amine curing agents such as 1-(2-aminoethyl) piperazine (AEP) and 5amino-1,3,3-trimethylcyclohexane methylamine isophorone diamine, IPDA) were studied. Incorporation of maleimide groups in the epoxy resin provides cyclic imide structure and high cross-linking density to the cured resins. The cured samples were found to have good thermal stability, chemical resistance (acid/alkali/solvent) and water absorption resistance.

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