Open AccessInfluence of Bonding Delaminations on The Electromechanical Admittance (EMA) of a Single-element Piezoelectric Transducer
Author(s) -
Wenxiang Ding,
Maxime Bavencoffe,
Marc Lethiecq
Publication year - 2020
Publication title -
hal (le centre pour la communication scientifique directe)
Language(s) - English
Resource type - Conference proceedings
DOI - 10.48465/fa.2020.0479
Subject(s) - admittance , delamination (geology) , materials science , finite element method , wedge (geometry) , transducer , rotational symmetry , acoustics , piezoelectricity , electrical impedance , ultrasonic sensor , structural engineering , composite material , engineering , mechanics , optics , electrical engineering , physics , paleontology , subduction , biology , tectonics