Open AccessMechanical Properties of Micro- and Nanostructured Copper Films
Author(s) -
N. Kosarev,
M.L. Khazin,
Р. А. Апакашев,
Н. Г. Валиев
Publication year - 2013
Publication title -
journal of materials science and chemical engineering
Language(s) - English
Resource type - Journals
eISSN - 2327-6053
pISSN - 2327-6045
DOI - 10.4236/msce.2013.15002
Subject(s) - materials science , copper , grain boundary , dislocation , metallurgy , composite material , hardening (computing) , grain size , microstructure , layer (electronics)
Mechanical properties of electrodeposited and electroless copper with nano- and crystalline structure are considered. Grain diameters in films ranged from 0.06 to 8 μm. A model is described which takes into account the grain boundary hardening and density of dislocation.
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