Experimental Study of Copper Nano-fluid on Thermosyphons Thermal Performance | Zendy

Jirapol Klinbun | Zendy; Pradit Terdtoon | Zendy

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Experimental Study of Copper Nano-fluid on Thermosyphons Thermal Performance

Author(s) -

Jirapol Klinbun,

Pradit Terdtoon

Publication year - 2017

Publication title -

engineering journal

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.246

H-Index - 20

ISSN - 0125-8281

DOI - 10.4186/ej.2017.21.1.255

Subject(s) - thermosiphon , nanofluid , working fluid , heat pipe , heat transfer , materials science , copper , work (physics) , thermodynamics , nano , thermal , fluid dynamics , mechanics , composite material , metallurgy , physics

A new way to remove the intense heat by developing and implementing an innovative low cost compact loop thermosyphon has been widely observed. Especially, it was concluded that nano-fluids are potential heat transfer fluids to be used as working fluid in thermosyphon. Therefore, the thermophysical or transport properties of nano-fluids in thermosyphon need to be discussed. In present work was to experimental study the thermal performance of thermosyphon using a copper nano-fluid as a working fluid. The experiment was performed in order to measure the temperature distribution and compare heat transfer rate of the thermosymphon with nano-fluid and with pure water. The concentration of copper nano-particle was 10, 30 and 50 ppm. The tested working temperature was 60, 70 and 80C. Results shown that the concentration of 50 ppm of copper nano-fluid improved thermal performance compared with the case of pure water. The optimum and behavior of copper nano-fluid in thermosyphon is presented, which highlights all of the beforehand mentioned advantages.

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