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Carbon nanotube (CNT) is considered as an ideal material for thermal management in electronic packaging because of its extraordinary high thermal conductivity. Fabricated onto a silicon substrate to form micro-channels, the CNT based cooling fins show high heat dissipation efficiency. A series of 2D and 3D CFD simulations have been carried out for CNT based micro-channel cooling architectures based on one and two dimensional fin array in this paper using COMSOL 4.0a software. Micro-channels are generally regarded as an effective method for the heat transfer in electronic products. The influence of various fluids, micro-fin structures, fluid velocity and heating powers on cooling effects have been simulated and compared in this study. Steady-state thermal stress analyses for the forced convection heat transfer are also performed to determine maximum allowable stress and deflections for the different types of cooling assembly

CFD Analysis for Optimum Thermal Design of Carbon Nanotube Based Micro-Channel Heatsink