Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations | Zendy

Adrien Debelle | Zendy; Laura Hermans | Zendy; Maxime Bosquet | Zendy; Sam Dehaeck | Zendy; Laurent Lonys | Zendy; Benoît Scheid | Zendy; Antoine clercq | Zendy; Anne Vanhoestenberghe | Zendy

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Soft Encapsulation of Flexible Electrical Stimulation Implant: Challenges and Innovations

Author(s) -

Adrien Debelle,

Laura Hermans,

Maxime Bosquet,

Sam Dehaeck,

Laurent Lonys,

Benoît Scheid,

Antoine clercq,

Anne Vanhoestenberghe

Publication year - 2016

Publication title -

european journal of translational myology

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.271

H-Index - 6

eISSN - 2037-7460

pISSN - 2037-7452

DOI - 10.4081/ejtm.2016.6298

Subject(s) - encapsulation (networking) , compatibility (geochemistry) , computer science , mold , stimulation , implant , manufacturing engineering , biomedical engineering , materials science , engineering , medicine , composite material , surgery , computer network

In this document we discuss the main challenges encountered when producing flexible electrical stimulation implants, and present our approach to solving them for prototype production. We include a study of the optimization of the flexible PCB design, the selection of additive manufacturing materials for the mold, and the chemical compatibility of the different materials. Our approach was tested on a flexible gastro-stimulator as part of the ENDOGES research program

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