Impact of Grain Structure and Material Properties on Via Extrusion in 3-D Interconnects

In this paper, the effects of Cu microstructure on the mechanical properties and extrusion of though-silicon vias (TSVs) were studied based on two types of TSVs with different microstructure. A direct correlation was found between the grain size and the mechanical properties of the vias. Both an analytical model and FEA were used to establish the relationship between the mechanical properties and via extrusion. The effect of via/Si interface on extrusion was also studied by FEA. The results suggest small and uniform grains in the Cu vias, as well as stronger interfaces between the via and Si led to smaller via extrusion, and are thus preferable for reduced via extrusion failure and improved TSV reliability.