Thermal Characterization and Simulation of a fcBGA-H device

In this paper, the thermal performance data of theta jc (Rth-JC) and theta ja (Rth-JA) of a flip chip ball grid array device with heat spreader, fcBGA-H, is measured. For Rth-JC, various boundary conditions for the thermal resistance modeling are considered and discussed. A transient measurement method is used to obtain the temperature responses of the diodes, as a function of time. The structure functions of the diodes are measured, and based on the structure functions, the thermal resistances are calculated. With the structure functions, the impact of package configurations are better viewed and demonstrated, and a novice measurement technique is also proposed here to measure the thermal resistance of junction to die, Rth-JD. With this experimental setup, there is no need to use the thermal couples. The traditional drilling hole for thermal couple and thermal couple itself will change the package configuration and heat dissipation path, and, therefore, impact the accuracy of the measurements. K eywords: TIM, thermal resistance, junction temperature, flip chip, structure function