Open AccessMoisture-Resistant Sealing Materials for Downhole HPHT Electrical Feedthrough Package
Author(s) -
Xia Hua,
Nelson Settles,
David DeWire
Publication year - 2019
Publication title -
journal of microelectronics and electronic packaging
Language(s) - Uncategorized
Resource type - Journals
SCImago Journal Rank - 0.192
H-Index - 17
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.942864
Subject(s) - materials science , composite material , moisture , ceramic , seal (emblem) , sintering , feedthrough , optoelectronics , art , visual arts
A bismuth oxide based multi-component glass system, xH3BO3-yBi2O3-(1-x-y-δ)MO-δ·REO with MO=TiO2, BaO, ZnO, Fe2O3, etc., and lanthanum series based rare earth oxides (REO), for making down...
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