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Finite Element Modeling of Rigid-Flex PCBs for Dynamic Environments
Author(s) -
John Bell,
Laura Redmond,
Kalind Carpenter,
Jean-Pierre de la Croix
Publication year - 2022
Publication title -
journal of microelectronics and electronic packaging
Language(s) - English
Resource type - Journals
eISSN - 1555-8037
pISSN - 1551-4897
DOI - 10.4071/imaps.1655356
Subject(s) - flex , finite element method , engineering , displacement (psychology) , mechanical engineering , sensitivity (control systems) , modal analysis , modal , propulsion , structural engineering , electronic engineering , aerospace engineering , psychology , telecommunications , chemistry , polymer chemistry , psychotherapist
Rigid-flex circuit boards are becoming more prevalent as the limits are pushed on the size, mass, and geometry of electronic systems. A key aspect of designing a rigid-flex printed circuit boards (PCB) system is an assessment of the dynamic properties of the PCB and predicting system performance under dynamic loading. Among current modeling methodologies for rigid-flex PCB, a simplified modeling methodology that adequately captures the system dynamics does not exist. This article presents a novel, computationally efficient approach for modeling rigid-flex PCB systems and the calibration of the material models via modal testing. The resulting simplified model is able to capture system frequencies, mode shapes, and representative force-displacement behavior. The proposed methodology is used to model NASA Jet Propulsion Laboratory’s Pop-Up Flat Folding Explorer Robot (PUFFER) and assess the sensitivity of a system model to input parameters.

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