Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill | Zendy

Ricky Tsun-Sheng Chou | Zendy; John H. Lau | Zendy; Gary Chang-Fu Chen | Zendy; Jones Yu-Cheng Huang | Zendy; Channing Cheng-Lin Yang | Zendy; Hsing-Ning Liu | Zendy; Tzyy-Jang Tseng | Zendy

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Heterogeneous Integration on 2.3D Hybrid Substrate Using Solder Joint and Underfill

Author(s) -

Ricky Tsun-Sheng Chou,

John H. Lau,

Gary Chang-Fu Chen,

Jones Yu-Cheng Huang,

Channing Cheng-Lin Yang,

Hsing-Ning Liu,

Tzyy-Jang Tseng

Publication year - 2022

Publication title -

journal of microelectronics and electronic packaging

Language(s) - English

Resource type - Journals

SCImago Journal Rank - 0.192

H-Index - 17

eISSN - 1555-8037

pISSN - 1551-4897

DOI - 10.4071/imaps.1546248

Subject(s) - flip chip , soldering , joint (building) , fabrication , materials science , substrate (aquarium) , reliability (semiconductor) , electronic engineering , drop (telecommunication) , integrated circuit packaging , package on package , mechanical engineering , composite material , integrated circuit , optoelectronics , engineering , structural engineering , medicine , wafer dicing , power (physics) , oceanography , adhesive , alternative medicine , physics , layer (electronics) , pathology , quantum mechanics , geology

In this study, the heterogeneous integration of two chips on a 2.3D hybrid substrate using solder joint and underfill is investigated. Emphasis is placed on the materials, design, process, fabrication, and reliability of the package. Drop test and results of the package are also provided.

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