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Three-dimensionally structured LTCC multilayer with channels and inner cavities are required for numerous applications like microreactors, microfluidic systems or sensors. For the performance of such devices, the dimensional accuracy of the embedded structures is crucial. In the green state, the desired structures can be precisely implemented in the LTCC tapes by laser cutting, punching or milling. Unfortunately, during lamination and sintering, shape integrity of cavities and channels is notably affected by warpage and deformation. To investigate the sintering behavior of structured LTCC laminates, a newly developed High Temperature Laser Profilometer (HTLP) can be used. The HTLP allows 3D in-situ shape detection of flat ceramic samples and tapes all along the sintering process. It is applicable for temperatures up to 1000 °C and sample sizes up to 200 mm × 200 mm × 10 mm. During a measurement, the rotating sample is scanned spirally by a linearly moving laser distance sensor through a slot in the furnace top wall. Distance and position values deliver a 3D surface image of the sample. Current lateral dimensions, which are determined by sintering shrinkage, can be measured continuously. Local deformation and warpage can be visualized time- and temperature-resolved. This new method was used, to analyze the sintering behavior of LTCC multilayer laminates containing large size cavities. These were fabricated out of punched green sheets by low pressure lamination without inserts. Samples with cavities of varying cross sections, as well as cavities with and without connection to the surface were observed.

In Situ Characterization of the Sintering Behavior of LTCC Laminates with Embedded Cavities by High Temperature Laser Profilometry