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Modern Active Electronically Steered Antennas (AESA) are operating in different platforms and systems. Inside EADS/CASSIDIAN the focus on X-Band antennas today is in airborne and fighter nose radars, in satellite based SAR antennas (Synthetic Aperture Radar) for earth observation and ground surveillance and security radars. Active antennas are assembled with hundreds or even thousands of T/R modules. This paper will describe an example of a so called standardized module solution based on LTCC package technology. State-of-the-art modules are assembled with active components like MMICs realized in GaAs technology, e.g. Low Noise Amplifier (LNA) and High Power Amplifier (HPA), Silicon based devices and passives. Assembly technologies are optimized for high yield series production inside CASSIDIAN MicroWave Factory. New semiconductor technologies, like GaN (Gallium Nitride) are enablers for a new T/R module generation. GaN/SiC based MMICs with higher power density compared with GaAs based devices are technological challenges for innovative thermal management solutions and assembly alternatives. GaN power devices are soldered on modern heatsink materials with high thermal conductivity and matched CTE (between MMIC and heatsink). Results of thermal simulations comparing different heatsink materials in combination with soldering techniques will be discussed and an optimized solution will be shown. Another type of T/R Module technology based on RF-PCB and packaged MMICs will be discussed. Future applications of ground-based security radars, active antenna products with a one-dimensional array and needs for cost-effective solutions seem to be SMD-based products. Different packages, e.g. QFN (Quad Flat Pack no Lead) and ceramic based (HTCC), mainly for power devices will be shown and compared.

Transmit/Receive (T/R) Modules – Key Elements for Phased Array Antennas