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First-Order SPICE Modeling of Extreme-Temperature 4H-SiC JFET Integrated Circuits
Author(s) -
Philip G. Neudeck,
David J. Spry,
Liangyu Chen
Publication year - 2016
Publication title -
additional conferences (device packaging hitec hiten and cicmt)
Language(s) - English
Resource type - Journals
ISSN - 2380-4491
DOI - 10.4071/2016-hitec-263
Subject(s) - jfet , spice , computer science , electronic engineering , nmos logic , integrated circuit , electronic circuit simulation , electronic circuit , transistor , field effect transistor , electrical engineering , engineering , voltage , operating system
A separate submission to this conference reports that 4H-SiC Junction Field Effect Transistor (JFET) digital and analog Integrated Circuits (ICs) with two levels of metal interconnect have reproducibly demonstrated electrical operation at 500 °C in excess of 1000 hours. While this progress expands the complexity and durability envelope of high temperature ICs, one important area for further technology maturation is the development of reasonably accurate and accessible computer-aided modeling and simulation tools for circuit design of these ICs. Towards this end, we report on development and verification of 25 °C to 500 °C SPICE simulation models of first-order accuracy for this extreme-temperature durable 4H-SiC JFET IC technology. For maximum availability, the JFET IC modeling is implemented using the baseline-version SPICE NMOS LEVEL 1 model that is common to other variations of SPICE software and importantly includes the body-bias effect. The first-order accuracy of these device models is veri...

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