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Silicon-Carbide Power MOSFET Performance in High Efficiency Boost Power Processing Unit for Extreme Environments
Author(s) -
Stanley A. Ikpe,
JeanMarie Lauenstein,
Gregory Carr,
Don Hunter,
Lawrence Ludwig,
William A. Wood,
Linda Y. Del Castillo,
Mohammad Mojarradi,
Fred D. Fitzpatrick,
Yuan Chen
Publication year - 2016
Publication title -
additional conferences (device packaging hitec hiten and cicmt)
Language(s) - English
Resource type - Journals
ISSN - 2380-4491
DOI - 10.4071/2016-hitec-184
Subject(s) - silicon carbide , materials science , power mosfet , mosfet , power semiconductor device , transistor , engineering physics , power (physics) , electrical engineering , junction temperature , silicon , optoelectronics , electronic engineering , engineering , voltage , physics , quantum mechanics , metallurgy
Silicon-Carbide (SiC) device technology has generated much interest in recent years. With superior thermal performance, power ratings and potential switching frequencies over its Silicon (Si) counterpart, SiC offers a greater possibility for high powered switching applications in extreme environment. In particular, SiC Metal-Oxide-Semiconductor Field-Effect Transistors' (MOSFETs) maturing process technology has produced a plethora of commercially available power dense, low on-state resistance devices capable of switching at high frequencies. A novel hard-switched power processing unit (PPU) is implemented utilizing SiC power devices. Accelerated life data is captured and assessed in conjunction with a damage accumulation model of gate oxide and drain-source junction lifetime to evaluate potential system performance at high temperature environments.

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