2.5D and 3D Integration Technology Update | Zendy

Robert Patti | Zendy

AI Assistant Blog Pricing

Home ZAIA Blog

Open Access

2.5D and 3D Integration Technology Update

Author(s) -

Robert Patti

Publication year - 2014

Publication title -

additional conferences (device packaging hitec hiten and cicmt)

Language(s) - English

Resource type - Journals

ISSN - 2380-4491

DOI - 10.4071/2014dpc-ta12

Subject(s) - wafer , perspective (graphical) , cover (algebra) , cmos , semiconductor device fabrication , nanotechnology , computer science , systems engineering , engineering , manufacturing engineering , materials science , electrical engineering , mechanical engineering , artificial intelligence

This publication will cover Tezzaron's latest advancements in 2.5D and 3D technology including new wafer to wafer integration of InP and GaAs with CMOS devices and new work in bonded die to wafer assembly with sub 25um pitch. A manufacturing perspective of the evolving customer requirements and the unique challenges in testing these highly complex devices will be discussed.

The content you want is available to Zendy users.

Already have an account? Click here to sign in.

Having issues? You can contact us here

Accelerating Research