New Advances in 3D/2.5D Integration

It is widely agreed that memory is the low hanging fruit of 2.5/3D integration. It demonstrates the advantages of bringing togther semiconductor processees and technologies that are difficult to cost effectively combine in an SOC. The presentation will describe the latest efforts to combine large memories with logic elements using interposers as well as a more full 3D stacking approach. Discussion of devices recently made and those in progress will include results and lessons learned.