Development of MEMS Power Sensor Package | Zendy

Bruce C. Kim | Zendy; Rahim Kasim | Zendy

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Development of MEMS Power Sensor Package

Author(s) -

Bruce C. Kim,

Rahim Kasim

Publication year - 2010

Publication title -

additional conferences (device packaging hitec hiten and cicmt)

Language(s) - English

Resource type - Journals

ISSN - 2380-4491

DOI - 10.4071/2010dpc-wp22

Subject(s) - microelectromechanical systems , power (physics) , fabrication , electrical engineering , computer science , electronic engineering , engineering , materials science , optoelectronics , physics , medicine , alternative medicine , pathology , quantum mechanics

This paper presents a design and fabrication of advanced MEMS in high power applications. The developed MEMS is used as a high power sensor for high current applications. We designed and fabricated MxN array of low power MEMS switches to handle high power which are mass actuated by an external magnetic field. The array of MEMS devices has been packaged in a conventional package and testing was performed to validate its operation. The switching time was very compatible with the existing solid state switches with much higher order of power capability.

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